Taipei, Taiwan – April 15, 2026 – Neousys Technology, a global leader in rugged embedded Edge AI platforms, today announced its participation in SEMICON Southeast Asia 2026 at booth: 2219, MITEC. Neousys will showcase its rugged industrial computers and Edge AI platforms designed for semiconductor production lines and facilities, empowering regional partners to achieve efficient and stable intelligent digital transformation amidst the rapid adoption of AI. Neousys will also cooperate with partners to demonstrate real-time vision inspection solutions.
Malaysia has emerged as a strategic hub for semiconductor manufacturing, driven by its growing market share in assembly, testing, and packaging (ATP) amid the ongoing diversification of global supply chains. To meet the surging demand of the region for real-time image recognition, automated material handling, security monitoring, and data analytics in semiconductor fabs, Neousys will present a comprehensive lineup of Edge AI computing platforms:
- NVIDIA® GPU-Powered High-Performance PCs (Nuvo-10109GC Series):
Featuring Neousys' exclusive thermal design and patented damping bracket, this series supports a high-end GPU up to 600W. It provides the massive computational power required for complex Automated Optical Inspection (AOI) in advanced packaging processes. - Ultra-Compact Rugged Designs (POC-960GC Series):
Making its debut at a semiconductor exhibition, POC-960GC supports a GPU and is designed for space-constrained environments. It operates in wide-temperature (-25°C to 70°C) environments and is shock/vibration resistant, ensuring zero-downtime performance in 24/7 continuous production lines. - NVIDIA® Jetson™ Powered Fanless Computers (NRU Series):
Combining an ultra-compact form factor with low power consumption and MIL-STD-810H vibration resistance, the NRU series delivers exceptional AI inference performance in restricted spaces. It is ideal for automated material handling and safety alert systems on mobile platforms. - One of Industry's First Jetson Orin™ NX/Nano Industrial Carrier Boards (Jemii-150 Series):
This BSP-matched Mini-ITX carrier board is flash-ready for NVIDIA® JetPack. Its Mini-ITX form factor offers customers versatile chassis options, providing a synchronized, seamless, and flexible Edge AI deployment platform.
Neousys' rugged designs are built to withstand the diverse industrial challenges. Through deep technical collaboration with NVIDIA®, Neousys ensures seamless hardware-software integration, allowing operators to quickly deploy AI models to the front lines. At the event, Neousys will partner with Taiwan’s professional system integrator IQUMIN and its Malaysian authorized distributor Apulsar to demonstrate the latest computing platforms and real-time vision inspection solutions, while fostering deep technical exchange with local industry leaders.
"Southeast Asia is evolving from a semiconductor manufacturing hub into a center for smart manufacturing R&D, where stability and durability are top priorities for local wafer fabs," said Patrick Liu, Sales Manager at Neousys Technology. "Our Edge AI platforms are engineered to adapt to the region's diverse industrial environments and serve as a critical catalyst in accelerating the deployment and development of real-world AI applications."