Nuvo-2700DS Series: Compact B key Supported Supported M.2 NVMe SSD Fanless USB 3.2 Gen1 -25°C to 70°C AMD Ryzen 64GB Google TPU Wall-mount
Specifications
Nuvo-2700DS Series: Compact B key Supported Supported M.2 NVMe SSD Fanless USB 2.0 -25°C to 70°C AMD Ryzen 64GB Google TPU Wall-mount
Specifications
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AMD Ryzen™ V1605B, 러기드 4K 양방향 디지털 사이니지 시스템, Google Edge TPU 2개 지원 | ||
是 | ||
173 mm (W) x 174 mm (D) x 50 mm (H) | ||
1.6 kg | ||
- | ||
AMD Ryzen™ Embedded V1605B CPU (4C/ 8T, 2M Cache, 2.0/ 3.6 GHz,12W - 25W TDP) |
||
- | ||
Vega GPU with 8 compute units | ||
Up to 64 GB DDR4-2400 SDRAM by two SODIMM sockets | ||
- | ||
- | ||
4x DisplayPort, supporting 4K UHD resolution | ||
2x RS-232 (COM1 in DB9, COM2 in RJ50) | ||
1x 3.5mm jack for mic-in and line-out | ||
2x half-size mini PCI Express socket for Google Edge TPU | ||
1x mini-DIN for 12V DC input or 1x 3-pin pluggable terminal block for 8V to 35V DC input (IGN/ GND/ V+) |
||
-25°C ~ 70°C | ||
CE/FCC Class A, according to EN 55032 & EN 55035 | ||
是 | ||
2x USB 3.1 Gen1 (5 Gbps) ports and 2x USB 2.0 | ||
1x M.2 3042/ 3052 B key (USB 3.1 Gen 1 + USB 2.0) for 4G/ 5G module with Micro SIM card slot 1x M.2 2230 E key (PCIe Gen3 x1 + USB 2.0) for WIFI module |
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2022-10-20 |
Nuvo-2700DS Series: Compact E key Supported Supported M.2 NVMe SSD Fanless USB 3.2 Gen1 -25°C to 70°C AMD Ryzen 64GB Google TPU Wall-mount
Specifications
|
||
AMD Ryzen™ V1605B, 러기드 4K 양방향 디지털 사이니지 시스템, Google Edge TPU 2개 지원 | ||
是 | ||
173 mm (W) x 174 mm (D) x 50 mm (H) | ||
1.6 kg | ||
- | ||
AMD Ryzen™ Embedded V1605B CPU (4C/ 8T, 2M Cache, 2.0/ 3.6 GHz,12W - 25W TDP) |
||
- | ||
Vega GPU with 8 compute units | ||
Up to 64 GB DDR4-2400 SDRAM by two SODIMM sockets | ||
- | ||
- | ||
4x DisplayPort, supporting 4K UHD resolution | ||
2x RS-232 (COM1 in DB9, COM2 in RJ50) | ||
1x 3.5mm jack for mic-in and line-out | ||
2x half-size mini PCI Express socket for Google Edge TPU | ||
1x mini-DIN for 12V DC input or 1x 3-pin pluggable terminal block for 8V to 35V DC input (IGN/ GND/ V+) |
||
-25°C ~ 70°C | ||
CE/FCC Class A, according to EN 55032 & EN 55035 | ||
是 | ||
2x USB 3.1 Gen1 (5 Gbps) ports and 2x USB 2.0 | ||
1x M.2 3042/ 3052 B key (USB 3.1 Gen 1 + USB 2.0) for 4G/ 5G module with Micro SIM card slot 1x M.2 2230 E key (PCIe Gen3 x1 + USB 2.0) for WIFI module |
||
2022-10-20 |
Nuvo-2700DS Series: Compact E key Supported Supported M.2 NVMe SSD Fanless USB 2.0 -25°C to 70°C AMD Ryzen 64GB Google TPU Wall-mount
Specifications
|
||
AMD Ryzen™ V1605B, 러기드 4K 양방향 디지털 사이니지 시스템, Google Edge TPU 2개 지원 | ||
是 | ||
173 mm (W) x 174 mm (D) x 50 mm (H) | ||
1.6 kg | ||
- | ||
AMD Ryzen™ Embedded V1605B CPU (4C/ 8T, 2M Cache, 2.0/ 3.6 GHz,12W - 25W TDP) |
||
- | ||
Vega GPU with 8 compute units | ||
Up to 64 GB DDR4-2400 SDRAM by two SODIMM sockets | ||
- | ||
- | ||
4x DisplayPort, supporting 4K UHD resolution | ||
2x RS-232 (COM1 in DB9, COM2 in RJ50) | ||
1x 3.5mm jack for mic-in and line-out | ||
2x half-size mini PCI Express socket for Google Edge TPU | ||
1x mini-DIN for 12V DC input or 1x 3-pin pluggable terminal block for 8V to 35V DC input (IGN/ GND/ V+) |
||
-25°C ~ 70°C | ||
CE/FCC Class A, according to EN 55032 & EN 55035 | ||
是 | ||
2x USB 3.1 Gen1 (5 Gbps) ports and 2x USB 2.0 | ||
1x M.2 3042/ 3052 B key (USB 3.1 Gen 1 + USB 2.0) for 4G/ 5G module with Micro SIM card slot 1x M.2 2230 E key (PCIe Gen3 x1 + USB 2.0) for WIFI module |
||
2022-10-20 |
Nuvo-2700DS Series: Compact M key Supported Supported M.2 NVMe SSD Fanless USB 3.2 Gen1 -25°C to 70°C AMD Ryzen 64GB Google TPU Wall-mount
Specifications
|
||
AMD Ryzen™ V1605B, 러기드 4K 양방향 디지털 사이니지 시스템, Google Edge TPU 2개 지원 | ||
是 | ||
173 mm (W) x 174 mm (D) x 50 mm (H) | ||
1.6 kg | ||
- | ||
AMD Ryzen™ Embedded V1605B CPU (4C/ 8T, 2M Cache, 2.0/ 3.6 GHz,12W - 25W TDP) |
||
- | ||
Vega GPU with 8 compute units | ||
Up to 64 GB DDR4-2400 SDRAM by two SODIMM sockets | ||
- | ||
- | ||
4x DisplayPort, supporting 4K UHD resolution | ||
2x RS-232 (COM1 in DB9, COM2 in RJ50) | ||
1x 3.5mm jack for mic-in and line-out | ||
2x half-size mini PCI Express socket for Google Edge TPU | ||
1x mini-DIN for 12V DC input or 1x 3-pin pluggable terminal block for 8V to 35V DC input (IGN/ GND/ V+) |
||
-25°C ~ 70°C | ||
CE/FCC Class A, according to EN 55032 & EN 55035 | ||
是 | ||
2x USB 3.1 Gen1 (5 Gbps) ports and 2x USB 2.0 | ||
1x M.2 3042/ 3052 B key (USB 3.1 Gen 1 + USB 2.0) for 4G/ 5G module with Micro SIM card slot 1x M.2 2230 E key (PCIe Gen3 x1 + USB 2.0) for WIFI module |
||
2022-10-20 |
Nuvo-2700DS Series: Compact M key Supported Supported M.2 NVMe SSD Fanless USB 2.0 -25°C to 70°C AMD Ryzen 64GB Google TPU Wall-mount
Specifications
|
||
AMD Ryzen™ V1605B, 러기드 4K 양방향 디지털 사이니지 시스템, Google Edge TPU 2개 지원 | ||
是 | ||
173 mm (W) x 174 mm (D) x 50 mm (H) | ||
1.6 kg | ||
- | ||
AMD Ryzen™ Embedded V1605B CPU (4C/ 8T, 2M Cache, 2.0/ 3.6 GHz,12W - 25W TDP) |
||
- | ||
Vega GPU with 8 compute units | ||
Up to 64 GB DDR4-2400 SDRAM by two SODIMM sockets | ||
- | ||
- | ||
4x DisplayPort, supporting 4K UHD resolution | ||
2x RS-232 (COM1 in DB9, COM2 in RJ50) | ||
1x 3.5mm jack for mic-in and line-out | ||
2x half-size mini PCI Express socket for Google Edge TPU | ||
1x mini-DIN for 12V DC input or 1x 3-pin pluggable terminal block for 8V to 35V DC input (IGN/ GND/ V+) |
||
-25°C ~ 70°C | ||
CE/FCC Class A, according to EN 55032 & EN 55035 | ||
是 | ||
2x USB 3.1 Gen1 (5 Gbps) ports and 2x USB 2.0 | ||
1x M.2 3042/ 3052 B key (USB 3.1 Gen 1 + USB 2.0) for 4G/ 5G module with Micro SIM card slot 1x M.2 2230 E key (PCIe Gen3 x1 + USB 2.0) for WIFI module |
||
2022-10-20 |