General overview
In the world of automated food and beverage production, label placement and defect check are often the final steps to final package production. But what if you wanted more than just a label check? What if you wanted an automated system that can check the final product, such as if the bottle is properly filled, or if the lid is properly screwed on in addition to detecting label misprints? This would guarantee better bottling quality for consumers by eliminating faulty bottles at the factory.
Problem-solving
To implement such a system, the point of detection requires a controller that can connect to multiple cameras to sample multiple snapshots of the bottle from various angles for false-negative and fault determination; it must also endure a subtle but constant vibration on the production line and high ambient operating temperatures. Upon fault detection, the system needs to recognize, register the data to track the bottle position in the lineup, wirelessly send data to the dedicated station further down the production line for elimination from the final packaging process.
Problem-solved
An ultra-compact controller with PoE+ and wide-temperature operation capabilities
The customer came to Neousys Technology and decided to implement an ultra-compact POC series controller and the solution can scan up to 400 bottles per minute. With multiple cameras and appropriate lighting, it was successful at detecting random and purposely placed faulty bottles (improper quantity, misplaced lid, label misprints and impurities/ sediment in the fluid) on registered positions in the lineup. Data were sent wirelessly to the QA station for the bottles to be removed from being packaged for delivery.
Controller specifications
- AMD Ryzen™ and Radeon Vega GPU offering up to 3.3 TFLOPS in FP16
- Compact dimensions, DIN-rail mountable
- Up to four camera connectivity, USB3.1 Gen 1 and PoE+ ports
- True wide-temperatue operation -40°C to 70°C ambient
- Mini-PCIe for WiFi/ 4G/ 5G wireless communication
- Shock and vibration proof
Neousys Ultra-Compact Wide Temperature Embedded Systems DNA
Fanless operation
Fanless operation and efficient heat dissipation
True wide temperature operation capable
Thrive in harsh conditions, capable of operating between -40°C and 70°C
Processing power
AMD Ryzen Embedded (4 core/ 8 thread) and Radeon Vega GPU with up to 3.6TFLOPS in FP16
Camera connectivity
USB 3.1 Gen 1 and PoE+ ports
Shock and vibration proof
The system is designed to withstand operating shock and vibration conditions with patented damping brackets.
Expansion capability
Neousys MezIO™ module offers computer signals, power rails and control signals via a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I/Os such as RS-232/422/485 and isolated DIO.
Wireless communication module and various I/O ports
Via expansion sockets, Neousys systems can install WiFi or 4G/ 5G cellular modules in the system. They offer wireless communication with other nearby devices, central computer or cloud systems. In addition, systems are also equipped MezIO™ expansion slot that allows for USB3.1 Gen1, USB3.1 Gen2, PoE, Gigabit Ethernet, storage, COM, etc. expansion.
